Package Reliability Engineer (f/m/d)

About This Opportunity

We are representing a confidential semiconductor technology client in their search for a Package Reliability Engineer in Aachen, Germany. Our client is developing advanced connectivity solutions for high-performance computing applications. This is an opportunity to join a growing organization at the forefront of next-generation chip packaging and photonic integration.

Reporting to the Quality & Reliability Program Lead, you will own the reliability of packaged products from mission profile definition through qualification and release. You will work closely with package architecture, device reliability, product engineering teams, and external partners to ensure robust, data-driven reliability strategies that enable confident product launches.

Responsibilities

• Define mission profiles and reliability targets including product operating conditions (temperature, voltage, humidity, thermal cycling, lifetime) and allocate FIT, MTBF, and lifetime targets across package, interconnect, and device-level contributors
• Assess package reliability risks by evaluating failure mechanisms across substrates, die attach, interconnects, solder joints, board attach, and optical/fiber interfaces including delamination, warpage, fatigue, electromigration, and optical or electrical drift
• Define and execute package reliability qualification plans covering thermal, mechanical, environmental, and board-level stress testing in accordance with JEDEC, AEC-Q100/Q006, IPC, IEC, and customer-specific requirements
• Lead the technical interface with OSATs, substrate suppliers, and testing laboratories, defining reliability requirements, reviewing data, and challenging results when supporting evidence is insufficient or unrepresentative
• Drive root-cause investigations and failure analysis leveraging techniques such as X-ray, C-SAM, cross-sectioning, SEM/EDX, and translate findings into corrective actions, design improvements, and requalification decisions
• Develop risk-based qualification strategies for novel packaging technologies where industry standards are incomplete or do not yet exist
• Provide data-driven release recommendations by assessing product readiness for customer sampling, qualification milestones, or production release while clearly communicating remaining reliability risks

What We're Looking For

• Master's degree (or equivalent experience) in Electrical Engineering, Microelectronics, Materials Science, Reliability Engineering, or related field
• 3–5+ years of experience evaluating semiconductor package construction (substrates, die attach, interconnects, solder joints) and understanding associated failure mechanisms
• Understanding of high-speed I/O and RF reliability, including how reliability degradation impacts high-speed serial, RF, and optical interfaces (signal integrity, insertion loss, jitter, eye closure over product lifetime). Experience with photonics reliability is highly desirable
• Solid foundation in reliability engineering including FIT and MTBF calculations, mission profile development, acceleration models, and translating product use cases into measurable reliability requirements
• Experience with industry qualification standards including JEDEC, AEC-Q100/Q006, IPC, and IEC, with judgment to apply knowledge-based qualification approaches when existing standards are insufficient
• Failure analysis expertise with ability to interpret results from X-ray, C-SAM, cross-sectioning, SEM/EDX and translate findings into risk-based recommendations
• Experience collaborating with OSATs, substrate suppliers, and external laboratories including defining technical reliability requirements and driving technical discussions
• Excellent cross-functional communication skills with ability to clearly communicate reliability risks, trade-offs, and evidence gaps to architects, engineers, suppliers, and leadership
• Thrives in a startup environment, demonstrating initiative, ownership, adaptability, and ability to make progress in a fast-paced, resource-conscious setting

How We Work with You

When you apply through Get A Job.ai, our talent team will review your qualifications and conduct an initial screening to understand your background and career goals. If there is a strong match, we will submit your profile to our client for consideration. Throughout the interview process, we will provide guidance and support. Please note that all applications must come through Get A Job.ai—direct contact with the client is not part of this process.

Pay

Compensation details will be discussed during the screening process based on your experience and qualifications.

Equal Employment Opportunity

Get A Job.ai is committed to inclusive hiring practices. We encourage qualified candidates from all backgrounds to apply and ensure fair consideration throughout our recruitment process.