Advanced Packaging Electrical / Signal Integrity Architect (f/m/d)

About This Opportunity

Our talent team is representing a confidential semiconductor technology organization based in Aachen, Germany. This is an exceptional opportunity to join a company working at the cutting edge of advanced packaging and high-speed interconnect solutions. We are seeking an Advanced Packaging Electrical / Signal Integrity Architect to own electrical characterization and co-design of next-generation semiconductor packages.

In this role, you will drive package-level electrical signoff by developing equivalent circuit models, leading signal and power integrity analysis, and translating high-speed interconnect requirements into optimized package architectures. You will work closely with ASIC/SerDes designers, packaging architects, and system teams to ensure designs meet demanding electrical performance targets while enabling chiplet and advanced packaging technologies.

Responsibilities

• Own electrical characterization and signoff of advanced semiconductor packages, including package equivalent circuit modeling, signal integrity (SI), power integrity (PI), crosstalk, and EMI/EMC analysis
• Develop and validate package-level electrical models (RLGC-equivalent circuits, S-parameters) for 2.5D/3D, interposer, fan-out, and chiplet-based package architectures
• Perform signal integrity analysis across die-package-board interfaces for high-speed SerDes, HBM, and die-to-die interconnects
• Define package stack-ups, substrate routing guidelines, via strategies, and bump-map/ball-out architectures from an electrical performance perspective
• Partner with packaging architects and ASIC teams to balance electrical, mechanical, thermal, manufacturing, and reliability requirements
• Build, validate, and correlate simulation models using industry-standard SI/PI and electromagnetic tools against laboratory measurements
• Support chip-package-board co-simulation and end-to-end channel budgeting in collaboration with ASIC, SerDes, and system engineering teams
• Collaborate with OSAT and foundry partners throughout package development, qualification, and manufacturing to ensure robust electrical performance and design-for-manufacturing compliance

What We're Looking For

• Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Physics, or related technical field, or equivalent experience
• 6+ years of experience in package or PCB signal integrity, power integrity, high-speed interconnect design, advanced packaging, or closely related hardware engineering roles
• Strong expertise in transmission line theory, electromagnetics, S-parameters, channel modeling, package equivalent electrical model development, and signal/power integrity analysis
• Hands-on experience with SI/PI simulation and modeling tools such as Ansys HFSS/SIwave, Cadence Sigrity, Keysight ADS, HSPICE, or equivalent
• Experience developing, validating, and correlating simulation models with laboratory measurements using VNA, TDR, high-speed oscilloscopes, or similar instrumentation
• Working knowledge of advanced packaging technologies including 2.5D/3D integration, interposers, fan-out packaging, chiplets, and high-density substrates
• Ability to collaborate effectively across ASIC, SerDes, package, mechanical, thermal, and manufacturing engineering teams
• Strong candidates may also have experience with scripting and automation using Python, Perl, Tcl, Cadence SKILL, or similar languages
• Experience with electrical/optical co-packaging, UCIe-class high-speed interconnects, or participation in industry standards organizations such as IEEE, OIF, or JEDEC is a plus
• Experience working with OSAT partners on package electrical qualification or advanced package manufacturing is beneficial

How We Work With You

When you apply through Get A Job.ai, a dedicated recruiter from our team will review your profile and conduct an initial screening to understand your background, technical expertise, and career goals. If there's a strong match, we will submit your candidacy to our client for consideration. Throughout the process, we serve as your advocate and primary point of contact.

Important: Please do not attempt to contact the client directly. All communication and interview coordination will be managed through Get A Job.ai to ensure a professional and streamlined experience.

Pay

Compensation details will be discussed during the screening process and are competitive with the German semiconductor industry market for this level of expertise.

Equal Employment Opportunity: Get A Job.ai is committed to creating an inclusive recruitment process. We welcome qualified candidates from all backgrounds and encourage applications from individuals of diverse experiences and perspectives.