Senior Packaging Engineer

Responsibilities

We are representing a confidential semiconductor organization seeking a Senior Packaging Engineer to lead IC packaging initiatives from concept through manufacturing. In this role, you will:

• Design packaging solutions from initial drawings and simulations through design-for-manufacturability
• Identify, evaluate, and manage external sub-contractors and establish necessary supply chains
• Collaborate cross-functionally with IC design, optical, and PCB teams to align packaging specifications across technical domains
• Lead chip industrialization processes, ensuring high yield and process capability metrics
• Oversee new product introduction and ramp-up phases for current and future devices
• Conduct thorough failure analysis and technical debugging

What We're Looking For

Our client requires a packaging specialist with deep expertise in photonics and heterogeneous integration:

• Master's degree in Electrical Engineering or Integrated Circuits Design
• 5+ years of experience in semiconductor and photonic packaging
• Expert-level proficiency in heterogeneous integration processes including wafer dicing, high-density Cu pillars and advanced bumping, flip-chip, redistribution layers, and encapsulation techniques
• Strong knowledge of die attach and bonding techniques such as epoxy, reflow, thermocompression, eutectic, laser-assisted bonding, and Cu-Cu direct bonding
• Experience with 2.5D/3D integration schemes including TSV reveal, die stacking, and interposer technologies
• Demonstrated expertise in photonic and optoelectronic packaging, particularly micro-scale optical alignment with passive and active alignment of lenses and optical fibers
• Experience with fine die placement (precision under 1µm) and non-Si semiconductors including InP and GaAs
• Proficiency in thermal, mechanical, and electromagnetic simulations
• Understanding of packaging industrialization, production flows, high-yield manufacturing, and Six Sigma methodology is highly valued
• English proficiency required; French language skills are a plus

How We Work With You

When you apply through Get A Job.ai, our talent team will conduct an initial screening to understand your background and match it to our client's needs. We will then submit qualified candidates to the client for consideration. Please do not attempt to contact the client directly, as all communication should flow through our recruiting team to ensure a smooth process for everyone involved.

Pay

Compensation details will be discussed during the screening process and are competitive within the semiconductor industry, based on your experience and location.

Equal Opportunity
Get A Job.ai is committed to inclusive hiring practices and works with clients who value diversity. We encourage applications from all qualified candidates regardless of background.