Senior ASIC Architect

About This Opportunity

We are representing a confidential semiconductor company at the forefront of next-generation compute architectures. Our client is seeking a Senior ASIC Architect to join their Paris-based team and lead the definition and realization of advanced multiphysics compute platforms from concept through production silicon.

This role offers the opportunity to work on cutting-edge hardware systems alongside a highly skilled, multicultural engineering team. You will own architectural vision across processing elements, interconnects, memory subsystems, and system-level control while mentoring cross-functional teams through full development cycles.

Responsibilities

• Drive top-level architecture for advanced compute platforms, including processing elements, interconnects, memory hierarchies, and system control
• Own architectural vision from initial concept through tape-out, including system modeling, specification development, and implementation handoff
• Lead and mentor cross-functional hardware teams across RTL design, functional verification, and physical integration to maintain consistent technical direction
• Collaborate with software, packaging, and system integration teams to ensure architectural decisions support platform scalability, performance, and reliability
• Evaluate emerging architectural directions, develop performance and cost models, and guide prototyping efforts to validate innovations for future generations

What We're Looking For

• Proven track record architecting complex, high-performance digital systems such as multicore processors, vector engines, or domain-specific accelerators
• Deep expertise in computer architecture principles: memory hierarchies, interconnects, cache coherence, instruction set design, and performance-power-area optimization
• Hands-on experience designing and integrating compute-intensive blocks including vector ALUs, SIMD pipelines, systolic arrays, and custom datapaths for signal or tensor processing
• Experience leading complete ASIC development cycles from architectural concept and modeling through RTL implementation, functional verification, physical design, and tape-out
• Experience with advanced system integration and packaging technologies such as HBM, chiplets, and 2.5D/3D integration is highly valued
• Strong leadership and communication skills with ability to align multidisciplinary teams under a unified technical vision

How We Work With You

Candidates apply directly through Get A Job.ai. Our recruiting team will conduct an initial screening to understand your background and match it to our client's requirements. If there is a strong fit, we will submit your profile to the client for consideration. Please do not contact the client directly, as all communications are managed through our talent team to ensure a smooth and confidential process.

Pay

Compensation details will be discussed during the screening process and are competitive based on experience and location. Our client offers equity participation, relocation support, healthcare coverage, pension contributions, professional development support, and 25 days of paid time off in addition to public holidays.

Equal Opportunity

Get A Job.ai is committed to inclusive hiring practices and equal employment opportunity. We welcome applications from candidates of all backgrounds.