- Company: Broadcom
- Location: USA-California-San Jose-1320 Ridder Park Drive
- New
- Full Time
- USA-California-San Jose-1320 Ridder Park Drive
- Apply on company site
Broadcom at a glance
broadcom.com- Founded 1991
SEC filings mentioning "Broadcom": 6,753 · SIC industry: Semiconductors & Related Devices — search EDGAR
Most recent 8-K (material company event) filed: Apr 9, 2018 — view filing
Broadcom began in 1991 as a fabless semiconductor firm focused on wireless and broadband chips. Avago acquired it for $37 billion in 2016; it now operates as part of Broadcom Inc. See Wikipedia.
5,450 Wikipedia views in June 2026 — a rough gauge of public visibility.
Broadcom seeks a Principal/Master Engineer – Silicon Photonics Advanced Packaging for a full-time on-site role at USA-California-San Jose-1320 Ridder Park Drive. Candidates searching for Principal/Master Engineer – Silicon Photonics Advanced Packaging jobs in USA-California-San Jose-1320 Ridder Park Drive, Principal/Master Engineer – Silicon Photonics Advanced Packaging near me, or Broadcom careers will find this leadership opportunity focused on sophisticated packaging solutions.
Position Summary
The Principal/Master Engineer – Silicon Photonics Advanced Packaging serves as a technical authority responsible for pioneering package architectures that integrate photonic devices with high-density electronic systems. Working fully on site at USA-California-San Jose-1320 Ridder Park Drive, the engineer balances optical performance, thermal dissipation, and mechanical reliability to deliver robust advanced packaging outcomes that support next-generation photonic applications within a collaborative full-time team setting.
What You'll Do
- Define and refine packaging architectures optimized for silicon photonics chips, ensuring efficient optical coupling and electrical interconnect integrity.
- Lead materials selection, process development, and qualification activities for advanced package formats suitable for photonic integrated circuits.
- Collaborate with design, process, and reliability colleagues to translate performance requirements into manufacturable packaging solutions.
- Conduct thermal-mechanical and optical analyses, then iterate package designs based on measured results to meet stringent photonic system targets.
- Mentor engineering team members and represent packaging expertise in cross-functional technical reviews and project planning at the USA-California-San Jose-1320 Ridder Park Drive site.
- Monitor emerging packaging technologies and introduce proven methods that enhance yield, density, and long-term reliability of silicon photonics assemblies.
Qualifications
- Advanced degree in electrical engineering, materials science, optics, physics, or a closely related field strongly preferred for Principal/Master Engineer – Silicon Photonics Advanced Packaging candidates.
- Extensive professional experience developing advanced packaging solutions for photonic or optoelectronic devices.
- Demonstrated expertise in silicon photonics packaging challenges, including low-loss optical interfaces, precision alignment, and thermal management of high-power photonic elements.
- Proven ability to guide packaging concepts from early design through process validation and high-volume readiness.
- Excellent communication and leadership skills to drive multi-disciplinary projects in an on-site environment such as USA-California-San Jose-1320 Ridder Park Drive.
About the Company
Broadcom is hiring for this role and offers a supportive team environment.
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To apply for this job please visit broadcom.wd1.myworkdayjobs.com.
Explore Broadcom online
What people say about Broadcom
Public chatter in the provided sources is mostly older Hacker News threads on Ethernet standards, Wi‑Fi firmware rules, and security markets, not employee reviews. Recent news highlights include Apple’s reported multi‑year U.S. chip spend with Broadcom and market coverage of AVGO moves (CNBC).
- Microsoft, Google et al to push 25/50 Gbps Ethernet
- New FCC Rules May Prevent Installing OpenWRT on WiFi Routers?
- Hacking Team: a zero-day market case study
Recent news
- Apple commits $30 billion to Broadcom for U.S. chipmaking push - CNBC
- Why Broadcom Stock Rose Today - Yahoo Finance
- Why Broadcom (AVGO) Stock Is Trading Up Today - Yahoo Finance
- Micron, Broadcom, Palantir, Delta, SpaceX, and More Stocks That Explain Today’s Market - Barron's
- Allstate Insurance quits Broadcom, alleges vengeful license audit on the way out - The Register
Aggregated from public discussions and news; opinions are the authors’ own.
Working in USA-California-San Jose-1320 Ridder Park Drive
🇺🇸 Relocation safety for US: Exercise Normal Caution — via Warnely, CC BY 4.0
National unemployment rate in US: 4.2% — via World Bank
Private-sector wage growth (year over year): 3.3% — via FRED
National quits rate: 1.9% — via FRED (BLS JOLTS)
GDP per capita in US: $90,027 — via World Bank
Consumer price inflation in US: 2.9% (annual) — via World Bank
Average hours worked per year in US: 1,800 — via OECD
Build the skills for this role
Prioritize silicon photonics packaging, optical I/O, thermal/mechanical co-design, and advanced assembly flows (e.g., 2.5D/3D, optical alignment). Strengthen DOE, failure analysis, and clear tech leadership across multi-site supply chains.
Be ready to walk through past packaging or photonics programs end-to-end: trade-offs, yield limiters, and how you influenced architecture. Expect deep dives on optical coupling, warpage/thermal stress, and partner-facing technical decisions.
Strong fit if you already lead silicon photonics or advanced packaging at principal depth and want on-site semiconductor work in San Jose at a large connectivity-focused chip company.
Job details above are provided by the employer/source. The sections on this page are compiled from public data sources with AI assistance.
Accommodations: if you need a workplace accommodation to apply for or perform this job, see ADA.gov or EEOC.gov for guidance on your rights and how to request one.
Listing facts
- Role Principal/Master Engineer – Silicon Photonics Advanced Packaging
- Employer Broadcom
- Location USA-California-San Jose-1320 Ridder Park Drive
- Type Full Time
- Posted July 13, 2026
- Apply by 2026-08-12
- Country context US
- Overview Full original description on this page (371 words; rewritten for clarity, not a teaser paste)
Facts above come from this job record on Get A Job.AI — not copied from third-party review sites.
Public discussions & open sources
Attributed public threads and profiles — not employee reviews or star ratings.
- Hacker News — Microsoft, Google et al to push 25/50 Gbps Ethernet
- Hacker News — Microsoft, Google et al to push 25/50 Gbps Ethernet
- Hacker News — New FCC Rules May Prevent Installing OpenWRT on WiFi Routers?
- Hacker News — Hacking Team: a zero-day market case study
Cached public sources (Hacker News, Dev.to, GitHub, etc.).
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