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Be ready to walk through past packaging or photonics programs end-to-end: trade-offs, yield limiters, and how you influenced architecture. Expect deep dives on optical coupling, warpage/thermal stress, and partner-facing technical decisions.
Strong fit if you already lead silicon photonics or advanced packaging at principal depth and want on-site semiconductor work in San Jose at a large connectivity-focused chip company.
As Principal/Master Engineer for silicon photonics advanced packaging at Broadcom in San Jose, expect deep ownership of packaging architecture, process bring-up with foundry/OSAT partners, and cross-team reviews with photonics, electrical, and reliability groups. Days mix design reviews, experimental data triage, and roadmap decisions that keep optical interconnect packages manufacturable at scale.
Prioritize silicon photonics packaging, optical I/O, thermal/mechanical co-design, and advanced assembly flows (e.g., 2.5D/3D, optical alignment). Strengthen DOE, failure analysis, and clear tech leadership across multi-site supply chains.
No. The listing is on-site at 1320 Ridder Park Drive, San Jose, California.
Broadcom’s roots are fabless broadband/wireless semiconductors (founded 1991); the historical Broadcom Corporation was acquired by Avago in 2016 and is part of Broadcom Inc.
No salary bands, Glassdoor/Indeed ratings, or employee review scores are in the provided data.
Website: broadcom.com
Broadcom Corporation was an American fabless semiconductor company that made products for the wireless and broadband communication industry. It was acquired by Avago Technologies for $37 billion in 2016 and currently operates as a wholly owned subsidiary of the merged entity Broadcom Inc.
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Broadcom seeks a Principal/Master Engineer – Silicon Photonics Advanced Packaging for a full-time on-site role at USA-California-San Jose-1320 Ridder Park Drive. Candidates searching for Principal/Master Engineer – Silicon Photonics Advanced Packaging jobs in USA-California-San Jose-1320 Ridder Park Drive, Principal/Master Engineer – Silicon Photonics Advanced Packaging near me, or Broadcom careers will find this leadership opportunity focused on sophisticated packaging solutions. Position Summary The Principal/Master Engineer – Silicon Photonics Advanced Packaging serves as a technical authority responsible for pioneering package architectures that integrate photonic devices with high-density electronic systems. Working fully on site at USA-California-San Jose-1320 Ridder Park Drive, the engineer balances optical performance, thermal dissipation, and mechanical reliability to deliver robust advanced packaging outcomes that support next-generation photonic applications within a collaborative full-time team setting. What You'll Do Define and refine packaging architectures optimized for silicon photonics chips, ensuring efficient optical coupling and electrical interconnect integrity. Lead materials selection, process development, and qualification activities for advanced package formats suitable for photonic integrated circuits. Collaborate with design, process, and reliability colleagues to translate performance requirements into manufacturable packaging solutions. Conduct thermal-mechanical and optical analyses, then iterate package designs based on measured results to meet stringent photonic system targets. Mentor engineering team members and represent packaging expertise in cross-functional technical reviews and project planning at the USA-California-San Jose-1320 Ridder Park Drive site. Monitor emerging packaging technologies and introduce proven methods that enhance yield, density, and long-term reliability of silicon photonics assemblies. Qualifications Advanced degree in electrical engineering, materials science, optics, physics, or a closely related field strongly preferred for Principal/Master Engineer – Silicon Photonics Advanced Packaging candidates. Extensive professional experience developing advanced packaging solutions for photonic or optoelectronic devices. Demonstrated expertise in silicon photonics packaging challenges, including low-loss optical interfaces, precision alignment, and thermal management of high-power photonic elements. Proven ability to guide packaging concepts from early design through process validation and high-volume readiness. Excellent communication and leadership skills to drive multi-disciplinary projects in an on-site environment such as USA-California-San Jose-1320 Ridder Park Drive. About the Company Broadcom is hiring for this role and offers a supportive team environment. Apply Today To…
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