ASIC Package Design Manager

Broadcom is hiring an ASIC Package Design Manager at USA-CA San Jose Innovation Drive for a full-time role leading package development on advanced ASIC programs.

The Opportunity

As ASIC Package Design Manager at Broadcom you will shape physical packaging strategy for sophisticated integrated circuits while working on-site at the USA-CA San Jose Innovation Drive campus. The role centers on guiding cross-functional packaging decisions that meet electrical, thermal, and manufacturability targets. You will influence technology selection and process improvements that keep Broadcom’s ASIC package design activities efficient and competitive. This full-time ASIC Package Design Manager position offers the chance to mentor specialists, define standards, and deliver production-ready package solutions in a fast-paced semiconductor environment.

Core Duties

• Lead end-to-end package design activities for new ASIC products, from concept through tape-out and production support
• Define package architecture, substrate stack-ups, floorplans, and interconnect schemes that satisfy signal-integrity, power-integrity, and thermal requirements
• Manage a team of package design engineers, set priorities, review work, and ensure delivery against program schedules
• Collaborate daily with ASIC design, signal-integrity, thermal, manufacturing, and reliability groups to resolve cross-domain issues
• Drive evaluation and adoption of advanced packaging technologies such as multi-chip modules, high-density substrates, and advanced interconnects
• Establish package design rules, checklists, and best-practice guidelines for the organization
• Support cost, yield, and quality analysis of package options throughout the product lifecycle
• Present technical status and risk assessments to program management and senior leadership

Who We're Looking For

• Proven background in semiconductor package design with increasing leadership responsibility for ASIC or high-performance IC packaging
• Deep understanding of flip-chip, wire-bond, substrate technologies, and associated design tools and flows
• Experience managing package design schedules, resources, and deliverables in a multi-project environment
• Solid knowledge of electrical and thermo-mechanical co-design considerations for complex packages
• Ability to mentor engineers and communicate technical detail clearly to both specialists and non-specialists
• Bachelor’s or Master’s degree in electrical engineering, mechanical engineering, materials science, or a related technical field
• Familiarity with industry packaging standards and package assembly processes is preferred

More About Broadcom

Broadcom is hiring for this role and offers a supportive team environment.

Applying for This Role

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