Ground every answer in facts on this page and the original listing. We never invent Glassdoor-style reviews or salaries that are not in our data.
Be ready to walk a package you owned end-to-end: floorplan constraints, bump map, substrate stack, SI/PI risk, yield/assembly issues, and how you drove suppliers and tape-out timing. Expect scenario questions on schedule slips, co-design with silicon teams, and trading cost versus performance on high-speed I/O.
Strong fit if you manage package design for high-performance ASICs and can lead engineers and vendors in a large semiconductor environment. On-site San Jose presence is expected (not remote). Limited official career/salary data in this listing—validate band and team scope in process.
As ASIC Package Design Manager at Broadcom in San Jose, the day centers on package architecture tradeoffs for complex ASICs: stackup and interconnect choices, signal/power integrity with design and SI teams, supplier and assembly readiness, and schedule risk on multi-die or high-bandwidth products. Expect design reviews, cross-site coordination, and release gates tied to silicon and board bring-up.
Prioritize advanced packaging (BGA/FCBGA, multi-chip, interposers), SI/PI fundamentals, thermal/mechanical constraints, and design-for-assembly with OSAT partners. Leadership depth in NPI schedules and cross-functional ASIC/package co-design matters more here than generic certifications; no cert cost list is available in the source data.
No. The listing is for USA–CA San Jose (Innovation Drive) with remote flagged off.
It’s a major semiconductor business rooted in fabless communications silicon and now part of the broader Broadcom Inc. group after the 2016 Avago deal—expect scale, product rigor, and package complexity.
No salary, star ratings, or Glassdoor/Indeed figures are in the provided data; confirm compensation and culture directly with the employer.
Website: broadcom.com
Broadcom Corporation was an American fabless semiconductor company that made products for the wireless and broadband communication industry. It was acquired by Avago Technologies for $37 billion in 2016 and currently operates as a wholly owned subsidiary of the merged entity Broadcom Inc.
Public cache only — not an employee review.
Broadcom is hiring an ASIC Package Design Manager at USA-CA San Jose Innovation Drive for a full-time role leading package development on advanced ASIC programs. The Opportunity As ASIC Package Design Manager at Broadcom you will shape physical packaging strategy for sophisticated integrated circuits while working on-site at the USA-CA San Jose Innovation Drive campus. The role centers on guiding cross-functional packaging decisions that meet electrical, thermal, and manufacturability targets. You will influence technology selection and process improvements that keep Broadcom’s ASIC package design activities efficient and competitive. This full-time ASIC Package Design Manager position offers the chance to mentor specialists, define standards, and deliver production-ready package solutions in a fast-paced semiconductor environment. Core Duties Lead end-to-end package design activities for new ASIC products, from concept through tape-out and production support Define package architecture, substrate stack-ups, floorplans, and interconnect schemes that satisfy signal-integrity, power-integrity, and thermal requirements Manage a team of package design engineers, set priorities, review work, and ensure delivery against program schedules Collaborate daily with ASIC design, signal-integrity, thermal, manufacturing, and reliability groups to resolve cross-domain issues Drive evaluation and adoption of advanced packaging technologies such as multi-chip modules, high-density substrates, and advanced interconnects Establish package design rules, checklists, and best-practice guidelines for the organization Support cost, yield, and quality analysis of package options throughout the product lifecycle Present technical status and risk assessments to program management and senior leadership Who We're Looking For Proven background in semiconductor package design with increasing leadership responsibility for ASIC or high-performance IC packaging Deep understanding of flip-chip, wire-bond, substrate technologies, and associated design tools and flows Experience managing package design schedules, resources, and deliverables in a multi-project environment Solid knowledge of electrical and thermo-mechanical co-design considerations for complex packages Ability to mentor engineers and communicate technical detail clearly to both specialists and non-specialists Bachelor’s or Master’s degree in electrical engineering, mechanical engineering, materials science, or a related technical field Familiarity with industry packaging standards and package assembly processes is preferred More About Broadcom Broadcom is hiring for this role and offers a supportive team environment. Applying for This Role To apply,…
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