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Ingénieur en Packaging Électronique-Equipements Spatiaux

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  • Company: AG
  • Location: Paris Area
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  • Full Time
  • Paris Area
  • Apply on company site

AG — company details are preparing and update automatically in a few seconds (or refresh).

Join AG as an Electronics Packaging Engineer for space equipment in the Paris Area. This full-time role offers the opportunity to design and develop advanced packaging solutions for aerospace applications, working with cutting-edge technology and industry-leading engineering teams.

About This Position

AG is seeking an experienced Electronics Packaging Engineer to join our space equipment division. In this role, you will contribute to the design, development, and optimisation of electronic packaging systems for demanding space environments. You will collaborate across engineering disciplines to ensure that all packaging solutions meet rigorous aerospace standards and mission-critical reliability requirements. Based in the Paris Area, you will support complex, high-stakes projects that define the future of space technology.

Key Responsibilities

  • Design and develop electronic packaging architectures for space equipment applications
  • Conduct thermal analysis and management strategies to ensure optimal performance in harsh space environments
  • Perform reliability assessments and failure mode analysis on packaging designs
  • Ensure compliance with aerospace standards, regulations, and quality requirements throughout the design lifecycle
  • Collaborate with cross-functional teams including systems engineers, manufacturing specialists, and quality assurance professionals
  • Document design specifications, test protocols, and technical justifications for review and approval
  • Support prototype development, testing, and validation of packaging solutions

Skills & Qualifications

  • Bachelor's degree in electrical engineering, mechanical engineering, materials science, or related discipline
  • Proven experience in electronic packaging design or a closely related field
  • Strong knowledge of thermal management and heat transfer principles
  • Familiarity with aerospace standards and quality frameworks (AES, ECSS, or equivalent)
  • Proficiency with CAD software and simulation tools
  • Excellent problem-solving abilities and attention to detail
  • Strong communication skills and ability to work effectively in multinational, cross-functional teams
  • Fluency in English; French is advantageous

More About AG

AG is a global leader in aerospace and defence, with a strong heritage of innovation in space technology. Our teams across the Paris Area are dedicated to pushing the boundaries of what's possible in space equipment design and manufacturing. We foster a collaborative, forward-thinking environment where engineering excellence and technical ambition drive everything we do.

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Listing facts

  • Role Ingénieur en Packaging Électronique-Equipements Spatiaux
  • Employer AG
  • Location Paris Area
  • Type Full Time
  • Posted July 11, 2026
  • Apply by August 10, 2026
  • Overview Full job description on this page (356 words)

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Ingénieur en Packaging Électronique-Equipements… AG · Paris Area