Hardware Design Engineer

THE ROLE

As a Hardware Design Engineer on the Datastore team, you will architect and launch our next-generation, high-performance solid-state storage solutions from concept to global mass production. Collaborating closely with cross-functional architecture, thermal, and joint development manufacturing (JDM) teams, you will pioneer high-speed hardware that directly reduces total cost of ownership (TCO) and energy consumption for our global customers. Your engineering leadership will fundamentally reshape data storage efficiency, transforming cutting-edge high-speed interfaces into reliable, market-ready enterprise products.

WHAT YOU’LL DO

• Own End-to-End Productization: Lead SSD hardware design activities—including schematic design, component selection, and layout reviews—to successfully transition next-generation storage solutions from initial architecture through to mass production.

• Drive System Interoperability: Design and execute cross-platform interoperability testing across complex server/storage systems and SSDs to ensure seamless integration and industry-leading reliability.

• Resolve Complex System Trade-offs: Evaluate and optimize critical system-level tradeoffs across mechanical, thermal, power, and signal integrity (SI) parameters to maximize hardware efficiency.

• Spearhead Root Cause Analysis: Diagnose and resolve complex hardware issues and field escalations by collaborating with diagnostics engineers and external manufacturing partners to establish robust failure analysis workflows.

• Innovate through Automation: Develop and implement Python or BASH automation tools and AI-driven methodologies to scale validation workflows and increase design efficiency.

WHAT YOU BRING

• Deep Hardware Expertise: Proven ability to design and validate complex hardware at the electrical, protocol, and functional levels, specifically utilizing high-speed interfaces and bus technologies (such as PCIe Gen5/Gen6, DDR, NAND, SPI, and I2C).

• Advanced Debugging Skills: Hands-on proficiency using high-speed oscilloscopes, differential probes, and protocol analyzers to isolate root causes and solve intricate hardware anomalies.

• Collaborative Communication: Excellent verbal and written communication skills in both Mandarin and English, enabling seamless collaboration with global engineering teams and joint development manufacturers.

• Adaptive Problem Solving: A proactive mindset with the agility to navigate fast-paced engineering environments, manage technical ambiguity, and provide technical mentorship to peers.

• Location: We are primarily an in-office environment and therefore, you will be expected to work from the Taiwan office in compliance with Pure’s policies, unless you are on PTO, or work travel, or other approved leave.